This machine uses Mask Pattern Type to automatically correct defects on resist pattern.
Defect correction before etching reduces rework time and pattern correction time after etching, so as to reduce production time and materials to be used.
・Based on inspection result with our inspection technology and defect sorting function, defects on resist pattern
are automatically corrected.
・Mask Pattern Method for defect correction in wide area (±250μ m) with high position accuracy (±0.5m)
・Self Repair Status Check Function
・Adoption of 266nm YAG Laser for fine processing
・Compatible with large glass up to G8 (2,200 x 2,500mm)
・Target: Resist pattern after TFT circuit development
・Repair Type: 266nm YAG Laser (4th harmonic) + Mask Pattern Method
・Repair Precision: ±1μm
