This is a optical inspection system and performs quick and high-precision inspection for package circuit board and wafer board of BGA and CSP.
Inspection resolution covers 2μm/pix～, so that the system is applicable to various inspections including high-precision inspection of dimensional defect and existence of mounted parts.
・This system is equipped with original CCD line sensor cameras and image processor for high-speed processing. (Ex. Scan speed: Approx. 125mm/s (Resolution 5m/pix))
・Geo-Processing function of the processor and original statistical matching method ensure inspection of variety patterns with less margin.
・The optimal optical system is to be selected for the subject in order to detect fine defects at high precision.
| Board Size (Customization acceptable) |
Wafer: 2～12 inch Board: 20x20mm～640x510mm |
| Resolution | 2μm/pix ～ |
| Inspection Items | Apparent defects (pattern disconnection, scratch, short, pinhole, foreign particle, discoloration, irregularity) Dimensional measurement (hole diameter, line width, dislocation) |
| Scanner Sensor | 7,400-pixel CCD Line Sensor |
| Output | 10 bitA/D 256 Gray Scale |
| Processing | Real-time comparison (Die to Die) Pattern matching, Statistical matching |
| Throughput | Approx. 90s/wafer (for 12” wafer at 2μm resolution) |
Pattern Inspection (BGA/CSP Package Circuit Board, Wafer)
Dimensional Inspection (Pattern, Ball, VIA Hole)
Foreign Particle Inspection (Inter-lead, On-lead)
Loader/Unloader Unit
Pattern Measurement Function
