This system measures bump height, diameter and coplanarity on package circuit board (BGA, CSP) and wafer, at high speed and accuracy.
Adoption of originally improved optics and data processing method “Time Delay Scanning” ensures high-accuracy measurement that has never been made with conventional light beam interruption method.
・High accuracy (3≤δ1.0μm) for bump height and coplanarity
・Inspection time for a sample under 2 seconds
Original processing algorithm and dedicated processor ensuring measurement of 10 thousands of high-density bump within the specified throughput
・Round bumps as small as φ30μm can be measured
| Board Size | Wafer: 2 ～12 inch Board: 20x20mm ～ |
| Resolution | Height measurement (Standard): Horizontal resolution (X, Y) = 5.8μm, Z = Approx. 0.1μm |
| Accuracy | Height/Coplanarity: 31.0m |
| Measurement Range | Z = 150m (Changeable) |
| Inspection Time | ～ 10 wafers/h (12 inch) |
| Processing | Light-section method + TDS (Time Delay Scanning) |
| Inspection Items | Height, Coplanarity, Board camber Options: Diameter, Area, Volume, Loss, Bridge |
Solder bump on package circuit board for BGA/CSP
AU bump on semiconductor wafer
