TOP Wafer Crack Inspection System ALIS-W > Solar Cell >
Micro-cracks and non-penetrated cracks are clearly detected without any influence of crystal grain on polycryctal silicon wafer.
Compatible with monocrystal wafer
・Transmission inspection with infrared laser
・Clear imaging of cracks without influence of grain on polycrystal silicon wafer
・Half crack and closed crack to be detected as well as non-penetrated crack
・Foreign particles within wafer can be detected
・Positioning-free construction with conveyor compatible with inline system
・Throughput as high as 3,600 wafers/hour
・Automatic crack discrimination, and output of crack length, number of defects and coordinates are available.
| Inspection Items | Micro crack, Non-penetrated crack, Closed crack, Half crack, Foreign particle |
| Detection Size | Crack length≥500μm |
| Targets | Monocrystal/polycrystal strings: 125mm～210mm |
| Inspection Time | 1s/wafer (Throughput: 3,600 wafers/h) |
・Outgoing inspection in wafer and slice manufacturers
・Incoming cell inspection
This system reduces cell crack rate and line-down time, and improves yield and machine operation rate.
