Information
Takano to Exhibit at “SEMICON Japan 2024” from December 11th to 13th, Introducing a New Service
December 5th,2024 exhibition
Takano is pleased to announce that we will be exhibiting at “SEMICON Japan 2024”, held from Wednesday, December 11th to Friday, December 13th, 2024 at Tokyo Big Sight. Our exhibition will include semiconductor inspection and appearance inspection equipment designed for device manufacturers, foundries, equipment manufacturers, and materials manufacturers. Takano covers a wide range of inspection solutions, from optical to laser inspection.
In addition to inspection equipment, we are pleased to introduce our new service: PSL Calibration Wafers, which will be presented for the first time at SEMICON Japan 2024. This service is expected to greatly contribute to quality control in manufacturing processes. Please visit Takano’s booth to learn more!
Exhibition Details:
Event Dates: December 11th (Wed) – 13th (Fri), 2024
Time: 10:00 AM – 5:00 PM
Venue: Tokyo Big Sight
Booth Number: East Hall 5, No. 5221
Official Website: SEMICON Japan 2024
Visitor Pre-Registration: Register Here
Featured Products
Wafer Surface Inspection Systems (WM Series)
| WM-10R | WM-7SR |
Our inspection systems are essential for semiconductor device manufacturing, material development, and equipment management. WM Series detect nanometer-level particles (contaminants) and are widely used domestically and internationally. Utilizing semiconductor lasers reduces running costs.
WM-7SR and WM-10R are internationally certified for safety.
More details here：
Wafer Visual Inspection Systems (Vi Series)
| Vi-4207 | Vi-4307 | Vi-5301 |
Vi inspect wiring patterns, cracks, and foreign object contamination on wafers with high precision. Our five models tailored to wafer size, device type, defect type, and inspection speed.
More details here:
Film Thickness & Unevenness Inspection System（Thinspector）
Performs high-speed, comprehensive thin film thickness measurements and uniformity inspections in a single scan, ensuring complete thickness management.
More details here:
Micro Bump Inspection System (ALTAX-300EX)
Utilizes in-house high-speed cameras to inspect micro bumps as small as 10 μm in diameter with a 20 μm pitch.
Package Height Inspection System (ALTAX-FS)
Measures bump height, diameter, and coplanarity on semiconductor wafers, BGA, and CSP substrates using the new "Mervel" inspection unit.
By adopting a uniquely improved optical system and data processing method (Time Delay Scanning), it is now possible to achieve high-precision measurements that were not possible with previous light-cutting methods.
More details here:
Film Visual Inspection System (Hawkeyes Series)
Designed for high-functionality films in optics, electronic materials, and battery components. Our proprietary cameras and image processing units achieve industry-leading inspection speeds and high-resolution defect detection.
More details here:
PSL Particle-Coated Wafer (New Service)
We are launching PSL (Polystyrene Latex) Particle Calibration wafers, essential for managing semiconductor equipment. These wafers are used to calibrate and evaluate wafer surface particle inspection systems, ensuring detection sensitivity and accuracy. Various particle sizes can be calibrated according to customer needs. This contributes to contamination control, equipment performance, and yield improvement in manufacturing processes.
Further details will be announced at our SEMICON Japan booth. Please visit us to discuss the optimal PSL coating service for your needs!