Thinspector (Whole-Surface Film Thickness Inspection System)

While conventional commercial spot film thickness measurement systems manage film thickness by measuring only a few points across the wafer, Takano's Thinspector can inspect the entire wafer surface in a single scan.

Key Features

• Unlike conventional methods that cannot detect film thickness abnormalities outside of measurement points, our system enables comprehensive film thickness measurement across the entire wafer surface without any gaps.
• By performing uniformity inspection alongside full-surface film thickness measurement, the system can detect subtle film thickness variations that would be buried within acceptable ranges in conventional film thickness measurements.
• High-speed execution of full-surface film thickness measurement and uniformity inspection (less than 1 minute for 12-inch wafers).

Specifications