Bump Height Inspection System (ALTAX Series)
About the ALTAX Series
ALTAX measures the height, diameter, and coplanarity of bumps formed on semiconductor wafers
and package substrates such as BGA and CSP with high speed and high precision.
It also supports indentation inspection after via filling and plating.
The adoption of proprietary, continually improved optics and data processing methods has enabled
high-precision measurement not possible with conventional light section methods.
Applications
- Core process (Dent inspection after hole filling and plating
- Back-end process (Post-bump placement inspection, bump height/diameter inspection, bump presence/missing inspection)
Target Markets
- R&D
- Package substrate manufacturers
- Advanced packaging, and more.
Defect Detection Example
Measurement Examples
Standard sample (Height gap: 30 µm)
Solder bump (Max height: 50 µm)
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Our own high-speed camera enables the fastest inspection speed in the industry
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Light section method supports
diverse inspection items (height, dent) -
Simultaneous 2D + 3D inspection
Specifications
| Specifications | 300EX | FS3 | FS6 | |
|---|---|---|---|---|
| Target Products | Wafer | Package Substrate | ||
| Target Size (mm) | ~300 | ~□ 650 | ||
| 2D Measurement | Inspection Item | Bump Diameter | Bump Diameter | |
| Measurement Accuracy | 3σ<0.4μm~ | 3σ<2.0μm~ | ||
| 3D Measurement | Compatible Bump Size | 10μm and above | 30μm and above | 60μm and above |
| Inspection Item | Dent, Bump Height, Coplanarity | |||
| Measurement Accuracy | 3σ<0.5μm | 3σ<0.6μm | 3σ<0.7μm | |