Packaging Inspection Systems
About Packaging Inspection Systems
With our proprietary optical technology and advanced 2D + 3D inspection, Takano delivers fast and highly accurate quality control for the packaging process of wafers and substrates (such as resin, PLP, and glass)
Bump Height Inspection System
ALTAX Series
ALTAX quickly and precisely measures bump height, diameter, and coplanarity on semiconductor wafers and package substrates like BGA and CSP, while also supporting dent inspection after via filling and plating. Enhanced optics and data processing provide greater accuracy compared to traditional light sectioning methods.