Back-End Inspection Systems
About Back-End Inspection Systems
Takano provides inspection systems to support quality control and yield management in back-end processes, including solutions for advanced vertically stacked devices such as chiplets.
Patterned Wafer Visual Macro Inspection System
Vi Series
Vi Series performs high-speed, high-precision defect inspection of circuit patterns, color variations, and cracks.
Non-Patterned Wafer Inspection System
WM Series
WM Series enables highly sensitive detection of particles and defects on non-patterned wafer surface and is utilized in a wide range of process control applications.
Bump Height Inspection System
ALTAX Series
ALTAX Series performs high-speed, high-resolution measurement of bump height, diameter, and coplanarity on semiconductor wafers and package substrates such as BGA and CSP, also support dent inspection after via filling and plating. Improved optics and data processing enable higher accuracy than conventional light-section method.