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High-speed 3D inspection is a technology that measures the shape and dimensions of products with high precision in a short time, instantly detecting defects.
This technology enables highly precise detection of unevenness and anomalies that were previously difficult to ascertain with 2D inspection, significantly enhancing the accuracy of quality control.
To achieve this, we have developed optimal sensor cameras, illumination, and image processing technologies, establishing high-speed, high-precision 3D inspection capabilities.

Point 1 Newly Developed Ultra-High-Speed CMOS Sensor

Capable of acquiring approximately 74 million 3D data points per second.

Point 2 In-Camera Hardware Processing

By integrating a processing circuit within the camera and outputting data converted into 3D, the burden of measurement processing is significantly reduced.

Point 3Projector Illumination

Developed a projector that projects lines with uniform brightness and high linearity.
Both projection and imaging utilize a telecentric optical system.

Point 4 TDS Processing (Time Delay Scanning)

To minimize the influence of surface conditions, we employ our proprietary TDS processing algorithm, achieving a measurement repeatability of 3σ < 1 μm.

Advantages

① High-Speed Measurement

• Enables in-line inspection on manufacturing lines.
• Provides real-time feedback for early process improvement.

② Non-Contact Measurement

• Non-contact, thus no impact on the inspected object.

③ High-Precision Height Measurement through Proprietary Image Processing Technology

Bump Measurement, Interposer Inspection

Package Substrates

• Bump Height Inspection
• Missing Bump Inspection
• Bump Misplacement Inspection
• Coplanarity
• Via Fill Height Inspection

Interposers

• Hole Diameter/Position

Even Faster 3D Inspection

• We plan to evaluate ways to shorten tact time.
• We will further optimize hardware and software to reduce inspection time and promote productivity improvement.

Through our newly developed ultra-high-speed CMOS sensor and proprietary image processing, we achieve high-precision 100% inspection, which was previously challenging with conventional non-contact 3D measurement technologies such as optical interference, confocal microscopy, and triangulation (stereo method, light section method, etc.).